CSE 291 High Performance Interconnect and Packaging Winter 2008

University of California, San Diego

Instructor

• CK Cheng, ckcheng+291@ucsd.edu, 858 534-6184

Schedule

• Lectures: 2:00-3:20PM, TTH, CSE 4109

Textbooks

• (H) High Speed Signal Propagation: Advanced Black Magic Howard Johnson and Martin Graham
• (D) Digital Systems Engineering William J. Dally, John W. Poulton

Content

• 1. Structure of Interconnect and Packaging, D2
• 2. Electrical and Physical Scaling, D1,H1
• 3. Transmission Line Model, D3,H2
• 4. Interconnect Signaling, D7,D8,H3,H5,H6
• 5. Transmitters and Receivers, D4,D11
• 6. Timing Interface, D10
• 7. Timing Components, D12
• 8. Noises, D6
• 9. Power Distribution, D5
• 10. Clock Distribution, D9,H12
• 11. Physical Interface
• 12. Heat Dissipation
• 13. Modeling and Simulation

Notes and Papers

• Lecture 1 on class structure, Blue Gene/L, z900, z9 cage, Processor packaging.
• Lecture 2 on scalability, power distribution.
• Lecture 3 on RLC extraction
• Lecture 4 on skin effect
• Lecture 5 on performance regions

Grading

• Homeworks 45%
• Final Project 55%