CSE 291 Interconnect and Packaging Winter 2006 University of California, San Diego

### Instructor

• CK Cheng, ckcheng+291@ucsd.edu, 858 534-6184

### Schedule

• Lectures: 12:30-1:50PM, TTH, SSB 106

### Textbooks

• (H) High Speed Signal Propagation: Advanced Black Magic Howard Johnson and Martin Graham
• (D) Digital Systems Engineering William J. Dally, John W. Poulton

### Content

• 1. Structure of Interconnect and Packaging, D2
• 2. Electrical and Physical Scaling, D1,H1
• 3. Transmission Line Model, D3,H2
• 4. Interconnect Signaling, D7,D8,H3,H5,H6
• 5. Transmitters and Receivers, D4,D11
• 6. Timing Interface, D10
• 7. Timing Components, D12
• 8. Noises, D6
• 9. Power Distribution, D5
• 10. Clock Distribution, D9,H12
• 11. Physical Interface
• 12. Heat Dissipation
• 13. Modeling and Simulation

### Homeworks

• Homework 1 (Due 1/19) Compare Blue Gene/L, z900, and z990 in terms of i. computation power, ii. communication latency, iii. communication bandwidth, iv. power efficiency, v. space efficiency. Define and explain your metrics.
• Homework 2: (Due 2/2) Given a channel covered by ground planes of copper, the physical dimensions are 80cm long and 1cm wide. Between the two ground planes, we use Liquid Crystal Polymer as an insolator. The Liquid Crystal Polymer is 200 um thick with an almost constant electric permittivity, 3.0. Assume that the voltage attenuation cannot be lower than 0.2. Assign the width, separation, and thickness of the signal wires to maximize the 3db bandwidth of the channel. i. show the curve of transfer function, ii. show the curve of characteristic impedance, iii. explain the solution.
• Homework 3: (Due 2/16) (D10) 10-1, 10-3, 10-4, 10-5, 10-6.
• Homework 4: (Due 2/23) Repeat Homework 2.